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SPZB250
ZigBee(R) module
Features
Integrated 2.4GHz, IEEE 802.15.4-compliant transceiver - 0 dBm nominal TX output power - -92 dBm RX sensitivity - + 2 dBm in boost mode - RX filtering for co-existence with IEEE 802.11g and Bluetooth devices - Integrated VCO and loop filter Integrated IEEE 802.15.4 PHY and MAC 128 kB Embedded Flash and 5 kB integrated SRAM for program and data storage 17 GPIO with alternate functions: - GPIOs - UART - I 2C - SPI - ADC 2 16-bit general purpose timers; one 16-bit sleep timer ADC , sigma-delta converter with 12 bit resolution On board 24 MHz stable crystal Selectable integrated RC oscillator (typ 10 kHz) or 32.768 kHz crystal for low power operation 1 A power consumption in deep sleep mode Watchdog timer and power on reset Pins available for Non-intrusive debug interface (SIF) Single supply voltage 2.1 to 3.6 Vdc CE compliant FCC compliant FCC ID:S9NZB250A

Description
SPZB250 is a low power consumption ZigBee(R) module based on SN250 ZigBee(R) Network Processor which integrates a 2.4GHz, IEEE 802.15.4-compliant transceiver as well as IEEE 802.15.4 PHY and MAC. It enables OEMs to easily add wireless networking capability to any electronic device. Such a module is a very comprehensive solution to build sensors with meshing and self healing capability as required in a WSN scenario. 24 MHz high stability crystal is available aboard the module to perform the timing requirements as per ZigBee(R) specifications. An additional 32.768 kHz crystal is provided for low power operation. A single supply voltage is requested to power the module. An integrated 2.5 GHz specific Murata antenna is aboard. The voltage supply also determines the I/O ports level allowing an easy interface with the host system. 128 kB Flash and 5 kB of static RAM are available for data and program storage. To support user defined applications, a number of peripherals such as GPIO, UART, I2C, ADC and general purpose timers are available and user selectable. The deep sleep mode with power consumption less than 1 A allows applications where the battery life is a key point. For other information and details, please refer to SN250 datasheet available at www.st.com
Rev 1 1/16
www.st.com 16

Applications

Industrial controls Sensor networking Monitoring of remote systems Home applications Security systems Lighting controls
October 2007
Contents
SPZB250
Contents
1 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 2.2 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 3.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 4.2 4.3 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 RF electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Appendix A FCC statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
A.1 A.2 Label instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Special requirement for Modular application . . . . . . . . . . . . . . . . . . . . . . . 13
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
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SPZB250
Block diagram
1
Block diagram
Figure 1. Block diagram
Vdd
32.768 kHz Xtal
24 MHz Xtal
RF antenna
SIF GPIO CONTR SIGN
SN 250 Tranceiver
Balun Filter
2
2.1
Pin settings
Pin connections
Figure 2. Pin connection diagram
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Pin settings
SPZB250
2.2
Pin description
Table 1.
Pin n
Pin description
Pin name Direction I/O Analog I I I/O Analog O I/O Analog O I/O I I I I/O I O I I/O O I I/O O I I I/O I O I/O I Digital I/O ADC input 2 External clock input of timer 2 External enable mask of timer1 Digital I/O ADC Input 1 Frame signal of PTI (Packet Trace Interface) Digital I/O ADC Input 0 Frame signal of PTI (Packet Trace Interface) Digital I/O SPI Master clock of Serial Controller SC2 Capture of Input B of timer 1 Active low reset ( an internal pull-up of 30 kohm typ is provided) Digital I/O UART CTS handshake of serial controller SC1 SPI master clock of serial controller SC1 Capture of Input A of timer 2 Digital I/O UART RTS handshake of serial controller SC1 Capture of Input B of timer 2 Digital I/O SPI master data out of serial controller SC2 SPI slave data in of serial controller SC2 Capture of input A of timer 1 Digital I/O SPI master data in of serial controller SC2 SPI slave data out of serial controller SC2 I2C data of serial controller SC2 Capture of input A of timer 2 Description
GPIO6 ADC2 1 TMR2CLK TMR1ENMSK GPIO5 2 ADC1 PTI_DATA GPIO4 3 ADC0 PTI_EN GPIO3 4 SSEL TMR2IB.1 5 RSTB GPIO11 CTS 6 MCLK TMR2IA.1 GPIO12 7 RTS TMR2IB.1 GPIO0 MOSI 8 MOSI TMR1IA.1 GPIO1 MISO 9 MISO SDA TMR2IA.2
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SPZB250 Table 1.
Pin n
Pin settings Pin description (continued)
Pin name GPIO2 MSCLK 10 MSCLK SCL TMR2IA.2 11 12 GND VDD GPIO7 13 ADC3 REG_EN GPIO8 VREF_OUT 14 TMR1CLK TMR2ENMSK IRQA GPIO9 TXD 15 MO MSDA TMR1IA.2 GPIO10 RXD 16 MI MSCL TMR1IB.2 17 18 SIF_CLK SIF_MISO Direction I/O O I I/O I -Power I/O Analog O I/O Analog I I I I/O O O I/O I I/O I I I/O I I O Digital I/O SPI master clock of serial controller SC2 SPI slave clock of serial controller SC2 I2C clock of serial controller SC2 Capture of Input B of timer 2 Ground Input power supply Digital I/O ADC Input 3 External regulator open collector output Digital I/O ADC reference output External clock input of timer 1 External enable mask of timer 2 External interrupt source A Digital I/O UART transmit data of serial controller SC1 SPI master data out of serial controller SC1 I2C data of serial controller SC1 Capture of input A of timer 2 Digital I/O UART receive data of serial controller SC1 SPI master data in of serial controller SC1 I2C clock of serial controller SC1 Capture of Input B of timer 2 Non-intrusive debug Interface Serial interface clock signal ( internal pulldown) Non-intrusive debug Interface Serial interface master IN/ Slave Out Non-intrusive debug Interface Serial interface master Out/ Slave In To guarantee a proper signal level when in deep sleep mode connect a 10k resistor to GND Non-intrusive debug Interface Serial interface load strobe ( Open collector with internal pull-up) To improve noise immunity connect a 10k resistor to VDD Description
19
SIF_MOSI
I
20
SIF_LOADB
I/O
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Pin settings Table 1.
Pin n
SPZB250 Pin description (continued)
Pin name GPIO16 TMR1OB 21 TMR2IB.3 IRQD GPIO15 TMR1OA 22 TMR2IA.3 IRQC GPIO14 TMR2OB 23 TMR1IB.3 IRQB GPIO13 24 TMR2OA TMR1IA.3 I I I/O O I Capture of Input B of timer 1 External interrupt source B Digital I/O Waveform output A of timer 2 Capture of Input A of timer 1 I I I/O O Capture of Input A of timer 2 External interrupt source C Digital I/O Waveform output B of timer 2 I I I/O O Capture of Input B of timer 2 External interrupt source D Digital I/O Waveform output A of timer 1 Direction I/O O Digital I/O Waveform output B of timer 1 Description
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SPZB250
Maximum ratings
3
3.1
Maximum ratings
Absolute maximum ratings
Table 2.
Symbol VDD VIN Tstg Tsold
Absolute maximum ratings
Values Parameter Min Module supply voltage Input voltage on any digital pin Storage temperature Soldering temperature < 10s -0.3 -0.3 -40 Max 3.6 Vdd+0.3 +85 240 V V C Unit
3.2
Operating ranges
Table 3.
Symbol VDD Tstg
Operating ranges
Values Parameter Module supply voltage Operating ambient temperature Conditions Min - 20C < T < 70 C 3.1 -20 Typ 3.3 Max 3.6 +70 V C Unit
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Electrical characteristics
SPZB250
4
4.1
Electrical characteristics
DC electrical characteristics
Table 4.
Symbol IRX IRX ITX ITX IDS IDS
DC electrical characteristics
Values Parameter RX current ( boost mode) Conditions Min Vdd = 3.0 V, T = 25 C Typ 38 36 42 36 4 4.5 Max mA mA mA mA A A Unit
RX current ( normal mode) Vdd = 3.0 V, T = 25 C TX current ( boost mode) TX current (normal mode) Deep sleep current (RC oscillator) Deep sleep current (32.768 kHz oscillator) Vdd = 3.0 V, T = 25 C Vdd = 3.0 V, T = 25 C 2.1 < Vdd < 3.6 V T = 25C 2.1 < Vdd < 3.6 V T = 25C
4.2
Table 5.
Symbol VIL VIH Iil Iih Ripu Ripd VOL VOH IOHS IOLS IOHH IOLH IOTot
DC I/O specification
DC Input / Output specification
Values Parameter Low Level Input Voltage High level input voltage Input current for logic 0 Input current for logic 1 Input pull-up resistor Input pull-down resistor Low level output voltage High level output voltage Output source current (GPIO 12 : 0 ) Output sink current (GPIO 12 : 0 ) Output source current (GPIO 16 : 13 ) Output sink current (GPIO 16 : 13 ) Total output current for I/O 0 0.82 x Vdd Conditions Min 2.1 < Vdd < 3.6 V 0 Typ Max 0.2 x Vdd Vdd -0.5 0.5 30 30 0.18 x Vdd Vdd 4 4 8 8 40 V V mA mA kW kW V V mA mA mA mA mA Unit
2.1 < Vdd < 3.6 V 0.8 x Vdd 2.1 < Vdd < 3.6 V 2.1 < Vdd < 3.6 V
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SPZB250
Electrical characteristics
4.3
RF electrical characteristics
Table 6.
Symbol
RF electrical characteristics
Values Parameter Frequency range Conditions Min 2.1 < Vdd < 3.6 V 2405 0 Vdd = 3.0V, 1% PER Vdd=3.0V -20 / + 70 C Normal / boost mode +/- 5 MHz +/- 10 MHZ -40 15 35 40 -92 40 25 Typ Max 2480 MHz dBm dBm ppm % dBm Unit
TX RX CFE
Output power Sensitivity Carrier frequency error Error Vector magnitude Adjacent channel rejection
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Mechanical dimensions
SPZB250
5
Mechanical dimensions
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 3. Mechanical dimensions
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SPZB250 Figure 4. Solder pad layout
Mechanical dimensions
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FCC statement
SPZB250
Appendix A
FCC statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio/TV technician for help.
Antenna
Our module type SPZB250 is for OEM integrations only. The end-user product will be professionally installed in such a manner that only the authorized antennas are used.
Caution
Any changes or modifications not expressed approved by the part responsible for compliance could cause the module to cease to comply with FCC rules part 15, and thus void the user's authority to operate the equipment.
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SPZB250
FCC statement
A.1
Label instruction
Instruction manual for FCC ID labeling
Module type: FCC-ID: ZigBee(R) module S9NZB250A SPZB250
This intends to inform you how to specify the FCC ID of our ZigBee(R) module SPZB250 on your final product. Based on the Public Notice from FCC, the product into which our transmitter module is installed must display a label referring to the enclosed module. The label should use wording such as "Contains Transmitter module FCC ID: S9NZB250A or "Contains FCC ID: S9NZB250A , any similar wording that expressed the same meaning may be use. It shows an example below Contains FCC ID: S9NZB250A
A.2
Special requirement for Modular application
The following requirements are fulfilled: 1. The modular transmitter must have its own RF shielding: The RF module used on the board fulfils the emission requirements of the FCC rules without additional shielding. The modular transmitter must have buffered modulation/data inputs: The module has a memory management unit inside of the IC. The processor interfacing with the external application by means general purpose I/O ( GPIO) , Uart, SPI. The processor interfaces also the RF part of the module exchanging data and command with it. Inside the processor a Flash memory is available to download the customer application and the ZigBee(R) profiles. The modular transmitter must have its own power supply regulation: The IC contains an own voltage regulation. In case of changes in the supply voltage VCC (for example caused by temperature changes or other effects), the internal voltage will be stabilized. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204: The RF module is for OEM (Original Equipment Manufacturer) integration only. The end-user product will be professionally installed in such a manner that only the authorized antenna is used. The modular transmitter must be tested in a stand-alone configuration: The RF module was tested in a stand-alone configuration. The modular transmitter must be labelled with its own FCC ID number: The RF module will be labelled with its own FCC ID number. When the module is installed inside the end-product, the label is not visible. The OEM manufacturer is instructed how to apply the exterior label.
2.
3.
4.
5. 6.
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FCC statement
SPZB250
7.
The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements: The EUT is compliant with all applicable FCC rules. Detail instructions are given in the product Users Guide. The modular transmitter must comply with any applicable RF exposure requirements. Maximum measured power output: 3,08 mW Maximum antenna gain: 0,6 dBi = numeric gain 1,148 (see also FCC test report)
8.

Maximum permissible exposure defined in 47 CFR 1.1310: 1 mW/cm. The RF module operates at low power level so it does not exceed the Commission's RF exposure guidelines limits; furthermore, Spread spectrum transmitters operate according to the Section 15.247 are categorically excluded from routine environmental evaluation.
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SPZB250
Revision history
6
Revision history
Table 7.
Date 08-Oct-2007
Document revision history
Revision 1 First release Changes
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SPZB250
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